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INTEGRATED CIRCUITS
DATA SHEET
TDA8926 Power stage 2 x 50 W class-D audio amplifier
Preliminary specification Supersedes data of 2002 Feb 07 2002 Oct 10
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.2 8.3 9 10 11 12 13 14 14.1 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power stage Protection Overtemperature Short-circuit across the loudspeaker terminals BTL operation LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS Duty factor 15 15.1 15.2 15.3 15.4 15.5 15.6 16 17 17.1 17.2 17.3 17.4 18 19 20
TDA8926
TEST AND APPLICATION INFORMATION BTL application Package ground connection Output power Reference design Reference design bill of material Curves measured in reference design PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2002 Oct 10
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Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
1 FEATURES 3 GENERAL DESCRIPTION
TDA8926
* High efficiency (>94%) * Operating voltage from 15 to 30 V * Very low quiescent current * High output power * Short-circuit proof across the load, only in combination with controller TDA8929T * Diagnostic output * Usable as a stereo Single-Ended (SE) amplifier or as a mono amplifier in Bridge-Tied Load (BTL) * Electrostatic discharge protection (pin to pin) * Thermally protected, only in combination with controller TDA8929T. 2 APPLICATIONS
The TDA8926 is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips: * TDA8926J: a digital power stage in a DBS17P power package * TDA8929T: the analog controller chip in a SO24 package. With this chip set a compact 2 x 50 W audio amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required, or depending on supply voltage and load, a very small one. The system operates over a wide supply voltage range from 15 up to 30 V and consumes a very low quiescent current.
* Television sets * Home-sound sets * Multimedia systems * All mains fed audio systems * Car audio (boosters). 4 QUICK REFERENCE DATA SYMBOL General; VP = 25 V VP Iq(tot) Po supply voltage total quiescent current efficiency no load connected Po = 30 W RL = 8 ; THD = 10%; VP = 25 V RL = 4 ; THD = 10%; VP = 21 V Mono bridge-tied load configuration Po 5 output power ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8926J DBS17P DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) VERSION SOT243-1 RL = 8 ; THD = 10%; VP = 21 V 80 100 - W 15 - - 30 40 25 35 94 30 45 - - - V mA % PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo single-ended configuration output power 37 50 W W
2002 Oct 10
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Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
6 BLOCK DIAGRAM
TDA8926
handbook, full pagewidth
VDD2 VDD1 13 5 6 DRIVER HIGH 7 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 10
MGW137
TDA8926J
4 1 2 9 3 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
EN1 SW1 REL1 STAB DIAG POWERUP
OUT1
BOOT2
EN2 SW2 REL2
14 17 16 CONTROL AND HANDSHAKE
OUT2
VSS1 VSS2
Fig.1 Block diagram.
2002 Oct 10
4
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
7 PINNING SYMBOL SW1 REL1 DIAG PIN 1 2 3 DESCRIPTION digital switch input; channel 1 digital control output; channel 1 digital open-drain output for overtemperature and overcurrent report digital enable input; channel 1 positive power supply; channel 1 bootstrap capacitor; channel 1 PWM output; channel 1 negative power supply; channel 1 decoupling internal stabilizer for logic supply negative power supply; channel 2 PWM output; channel 2 bootstrap capacitor; channel 2 positive power supply; channel 2 digital enable input; channel 2 enable input for switching on internal reference sources digital control output; channel 2 digital switch input; channel 2
SW2 17
MGW141
TDA8926
handbook, halfpage
SW1 REL1 DIAG EN1 VDD1 BOOT1 OUT1 VSS1 STAB
1 2 3 4 5 6 7 8 9
EN1 VDD1 BOOT1 OUT1 VSS1 STAB VSS2 OUT2 BOOT2 VDD2 EN2 POWERUP REL2 SW2
4 5 6 7 8 9 10 11 12 13 14 15 16 17
TDA8926J
VSS2 10 OUT2 11 BOOT2 12 VDD2 13 EN2 14 POWERUP 15 REL2 16
Fig.2 Pin configuration.
2002 Oct 10
5
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
8 FUNCTIONAL DESCRIPTION 8.2 Protection
TDA8926
The combination of the TDA8926J and the TDA8929T controller produces a two-channel audio power amplifier system using the class-D technology (see Fig.3). In the TDA8929T controller the analog audio input signal is converted into a digital Pulse Width Modulation (PWM) signal. The power stage TDA8926 is used for driving the low-pass filter and the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. For a description of the controller, see data sheet "TDA8929T, Controller class-D audio amplifier". 8.1 Power stage
Temperature and short-circuit protection sensors are included in the TDA8926. The protection circuits are operational only in combination with the controller TDA8929T. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated. The controller has to take appropriate measures by shutting down the system. 8.2.1 OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 C, then pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 C, so there is a hysteresis of approximately 20 C. 8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
The power stage contains the high-power DMOS switches, the drivers, timing and handshaking between the power switches and some control logic. For protection, a temperature sensor and a maximum current detector are built-in on the chip. For interfacing with the controller chip the following connections are used: * Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches * Release (pins REL1 and REL2): digital outputs; switching from VSS to VSS + 12 V; follow SW1 and SW2 with a small delay * Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM outputs are floating; at a level of VSS + 12 V the power stage is operational and controlled by the switch pin if pin POWERUP is at VSS + 12 V * Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS + 5 V with respect to VSS * Diagnostics (pin DIAG): digital open-drain output; pulled to VSS if the temperature or maximum current is exceeded.
When the loudspeaker terminals are short-circuited this will be detected by the current protection. If the output current exceeds the maximum output current of 5 A, then pin DIAG becomes LOW. The controller should shut down the system to prevent damage. Using the controller TDA8929T the system is shut down within 1 s, and after 220 ms it will attempt to restart the system again. During this time the dissipation is very low, therefore the average dissipation during a short circuit is practically zero.
2002 Oct 10
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IN1- 4 23 REL1 Vi(1) IN1+ 5 SGND1 2 INPUT STAGE PWM MODULATOR 24 SW1 21 EN1 mute SGND VSSA ROSC OSC 7 OSCILLATOR MANAGER STABI 19 STAB STAB 9 22 DIAGCUR TEMPERATURE SENSOR AND CURRENT PROTECTION VSS1 VDD2 12 BOOT2 POWERUP 15 REL1 2 SW1 1 EN1 4 CONTROL AND HANDSHAKE DRIVER HIGH 7 DRIVER LOW OUT1 VMODE MODE 6
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
VDDA VSSA VDDA VSS1 VDD1 3 1 VDDD VDD2 VDD1 13 5 R fb 20 PWM1 +25 V
TDA8929T
TDA8926J
6
BOOT1
15 DIAGTMP DIAG 3
MODE SGND
handbook, full pagewidth
7
IN2+ 8 Vi(2) IN2- 9
SGND2 11
mute
16 EN2 13 SW2
EN2 14 CONTROL SW2 17 AND 16 HANDSHAKE REL2
DRIVER HIGH
11 OUT2
SGND (0 V)
INPUT STAGE
PWM MODULATOR
14 REL2 17 PWM2
DRIVER LOW
R fb 12 VSS2(sub) 10 VDD2 18 VSSD 8 10 VSS1 VSS2 -25 V VSSA
VSSA VDDA VSSD
Preliminary specification
MGU387
TDA8926
Fig.3 Typical application schematic of the class-D system using controller TDA8929T and the TDA8926J.
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
8.3 BTL operation
TDA8926
In this way the system operates as a mono BTL amplifier and with the same loudspeaker impedance a four times higher output power can be obtained. For more information see Chapter 15.
BTL operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a BTL output filter between the two outputs (pins OUT1 and OUT2) of the power stage (see Fig.4).
handbook, full pagewidth
VDD2 VDD1 13 5 6 DRIVER HIGH 7 OUT1 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 OUT2 DRIVER LOW 8 10
MGU385
TDA8926J
4 1 2 9 3 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
EN1 SW1 REL1 STAB DIAG POWERUP
SGND (0 V) BOOT2
EN2 SW2 REL2
14 17 16 CONTROL AND HANDSHAKE
VSS1 VSS2
Fig.4 Mono BTL application.
2002 Oct 10
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Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
9 LIMITING VALUES In accordance with the Absolute Maximum Rate System (IEC 60134). SYMBOL VP VP(sc) IORM Tstg Tamb Tvj Ves(HBM) PARAMETER supply voltage supply voltage for short-circuits across the load repetitive peak current in output pins storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage (HBM) note 1 all pins with respect to VDD (class 1a) -500 all pins with respect to VSS (class 1a) -1500 all pins with respect to each other (class 1a) Ves(MM) electrostatic discharge voltage (MM) note 2 all pins with respect to VDD (class B) -250 all pins with respect to VSS (class B) all pins with respect to each other (class B) Notes 1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF. 2. Machine Model (MM); Rs = 10 ; C = 200 pF; L = 0.75 H. 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-c) PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air in free air VALUE 40 1.0 -250 -250 -1500 CONDITIONS - - - -55 -40 - MIN.
TDA8926
MAX. 30 30 5 +150 +85 150 +500 +1500 +1500 V V A
UNIT
C C C V V V
+250 +250 +250
V V V
UNIT K/W K/W
11 QUALITY SPECIFICATION In accordance with "SNW-FQ611-part D" if this device is used as an audio amplifier (except for ESD, see also Chapter 9).
2002 Oct 10
9
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
12 DC CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in test diagram of Fig.6; unless otherwise specified. SYMBOL Supply VP Iq(tot) supply voltage total quiescent current note 1 no load connected outputs floating Internal stabilizer logic supply (pin STAB) VO(STAB) VIH VIL VOH VOL VOL ILO VIH VIL VEN(hys) II(EN) VPOWERUP II(POWERUP) Tdiag Thys Notes 1. The circuit is DC adjusted at VP = 15 to 30 V. 2. Temperature sensor or maximum current sensor activated. stabilizer output voltage 11 13 - - - - - - 9 5 4 - - 100 - 20 15 - - 25 35 5 PARAMETER CONDITIONS MIN. TYP.
TDA8926
MAX. 30 45 10
UNIT
V mA mA
15
V
Switch inputs (pins SW1 and SW2) HIGH-level input voltage LOW-level input voltage referenced to VSS referenced to VSS referenced to VSS referenced to VSS IDIAG = 1 mA; note 2 no error condition 10 0 VSTAB 2 V V
Control outputs (pins REL1 and REL2) HIGH-level output voltage LOW-level output voltage 10 0 VSTAB 2 V V
Diagnostic output (pin DIAG, open-drain) LOW-level output voltage output leakage current 0 - - 0 - - referenced to VSS VPOWERUP = 12 V 5 - 150 - 1.0 50 V A V V V A V A C C
Enable inputs (pins EN1 and EN2) HIGH-level input voltage LOW-level input voltage hysteresis voltage input current referenced to VSS referenced to VSS VSTAB - - 300
Switching-on input (pin POWERUP) operating voltage input current 12 170 - -
Temperature protection temperature activating diagnostic VDIAG = VDIAG(LOW) hysteresis on temperature diagnostic VDIAG = VDIAG(LOW)
2002 Oct 10
10
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
13 AC CHARACTERISTICS SYMBOL PARAMETER CONDITIONS RL = 8 ; VP = 25 V THD = 0.5% THD = 10% RL = 8 ; VP = 30 V THD = 0.5% THD = 10% RL = 4 ; VP = 21 V THD = 0.5% THD = 10% THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Po THD closed-loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 RL = 8 ; THD = 0.5% RL = 8 ; THD = 10% total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Notes closed loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 - - 35 - 0.01 0.1 36 94 - - 29 - 70(2) 80(2) 0.01 0.1 30 94 30(2) 40(2) 40 50 - - 40 52 25(2) 30(2) 30 37 MIN. TYP.
TDA8926
MAX.
UNIT
Single-ended application; note 1 Po output power - - - - - - 0.05 - 31 - - - 0.05 - 37 - W W W W W W % % dB %
Mono BTL application; note 5 output power 80 100 W W % % dB %
1. VP = 25 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (SE application) shown in Fig.7; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 22 kHz. When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 4. Efficiency for power stage; output power measured across the loudspeaker load. 5. VP = 21 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (BTL application) shown in Fig.7; unless otherwise specified.
2002 Oct 10
11
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
14 SWITCHING CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - from pin SW1 (SW2) to pin OUT1 (OUT2) note 1 - - - TYP.
TDA8926
MAX. - - - - 270 0.3
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.5 tr tf tblank tPD tW(min) Rds(on) Note 1. When used in combination with controller TDA8929T, the effective minimum pulse width during clipping is 0.5tW(min). 14.1 Duty factor rise time fall time blanking time propagation delay minimum pulse width on-resistance of the output transistors 30 30 70 20 220 0.2 ns ns ns ns ns
For the practical useable minimum and maximum duty factor () which determines the maximum output power: t W(min) x f osc t W(min) x f osc ------------------------------- x 100% < < 1 - ------------------------------ x 100% - 2 2 Using the typical values: 3.5% < < 96.5%.
2002 Oct 10
12
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
handbook, full pagewidth
1/f osc VDD PWM output (V) 0V
VSS tr t PD VSTAB VSW (V) VSS tf t blank
VSTAB VREL (V) VSS 100 ns
MGW145
Fig.5 Timing diagram PWM output, switch and release signals.
2002 Oct 10
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2002 Oct 10
12 k
15 TEST AND APPLICATION INFORMATION
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
VDD2 13
VDD1 5 6 BOOT1 15 nF 7 OUT1
TDA8926J
EN1 4 SW1 1 REL1 2 STAB 9 DIAG 3 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE DRIVER HIGH
DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 VSS1 10 VSS2 VOUT2 V BOOT2 VOUT1 V 2VP
14
12 V
POWERUP 15
EN2 14 100 nF SW2 17 REL2 16 V VEN VSW1
12 V 0
15 nF OUT2
CONTROL AND HANDSHAKE
V VREL1 VSTAB
V VDIAG VSW2
12 V 0
V VREL2
MGW183
Preliminary specification
TDA8926
Fig.6 Test diagram.
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
15.1 BTL application
TDA8926
When using the system in a mono BTL application (for more output power), the inputs of both channels of the PWM modulator must be connected in parallel; the phase of one of the inputs must be inverted. In principle the loudspeaker can be connected between the outputs of the two single-ended demodulation filters. 15.2 Package ground connection
The heatsink of the TDA8926J is connected internally to VSS. 15.3 Output power
The output power in single-ended applications can be estimated using the formula
2 RL ------------------------------------------------ x V P x ( 1 - t W(min) x f osc ) ( R L + R ds(on) + R s ) = -------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = --------------------------------------------------------------- should not exceed 5 A. R L + R ds(on) + R s The output power in BTL applications can be estimated using the formula
2 RL --------------------------------------------------------- x 2V P x ( 1 - t W(min) x f osc ) R L + 2 x ( R ds(on) + R s ) = --------------------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ 2V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = -------------------------------------------------------------------- should not exceed 5 A. R L + 2 x ( R ds(on) + R s ) Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping The output power at THD = 10%: Po(10%) = 1.25 x Po(1%). 15.4 Reference design
The reference design for a two-chip class-D audio amplifier for TDA8926J and controller TDA8929T is shown in Fig.7. The Printed-Circuit Board (PCB) layout is shown in Fig.8. The bill of materials is given in Table 1.
2002 Oct 10
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C25 470 nF
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
VDDA R19 39 k
mode select
VDDA R20 39 k 3 6
C1 C2
220 nF 220 nF VSSA
VDDD C10 560 pF R11 5.6 SW2 REL2 EN2 VDDD R24 200 k C4 220 nF D2 (7.5 V) 17 16 14 U1 12 11 OUT2 C8 15 nF
VSSD C11 560 pF R12 5.6
VDD1 VDD2 MODE 10
VSS2 VSS1 12 1 PWM2 17 SW2 13 REL2 14 EN2 16
QGND C18 1 nF
D1 (5.6 V)
on mute off
S1
C44 220 nF R1 OSC
L2
OUT2-
1 2
Sumida 33 H CDRH127-330 R15 24 C15 220 nF C19 1 nF QGND
4 or 8 SE
GND VSSA
7
27 k C3 220 nF SGND1 GND SGND2 2
U2
BOOT2 VDD1 VDD2 C7 220 nF VSS2 VSS1 C6 220 nF C14 470 nF VDDD
OUT2+
TDA8929T
19
STAB
POWERUP C5 STAB
15 9
18 11 22 5 CONTROLLER
VSSD
TDA8926J or TDA8927J
5 13
OUT2-
2
VSSA VSSD C43 R10 180 pF 1 k
GND
1
220 nF DIAG
8 BTL
10 3 POWER STAGE 8
IN1+ C22 330 pF
DIAGCUR
VSSD
C17 220 nF C16 470 nF R16 24
OUT1+ QGND C20 1 nF
IN1- IN2+
4 8
21 23 24
EN1 REL1 SW1 PWM1
EN1 REL1 SW1
4 2 1
6
BOOT1 C9 15 nF Sumida 33 H CDRH127-330 L4 R13 5.6 C12 560 pF R14 5.6 C13 560 pF VSSD
OUT1-
2 1
J5 J6 C24 470 nF R5 10 k C28 1 nF C26 470 nF R4 10 k
C23 330 pF
OUT1 7
4 or 8 SE
IN2-
9 15
20
C21 1 nF QGND
OUT1+
C27 470 nF R6 10 k C29 1 nF +25 V R7 10 k
outputs
n.c. QGND C30 1 nF VDD 1 2 3 VSS C31 1 nF QGND R22 9.1 k bead L6 C33 220 nF C35 1500 F (35 V) VSSD C38 220 nF C39 220 nF L5 bead R21 10 k C32 220 nF C34 1500 F (35 V) VDDD C36 220 nF C37 220 nF L7 bead
VDDD VDDA C40 47 F (35 V) GND C41 47 F (35 V) VSSA
input 1 J1 QGND J2 VSS J3 J4
input 2
GND -25 V
QGND
inputs
power supply
MLD633
handbook, full pagewidth
Preliminary specification
R21 and R22 are necessary only in BTL applications with asymmetrical supply. BTL: remove R6, R7, C23, C26 and C27 and close J5 and J6. C22 and C23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker). Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3) for an input signal ground reference.
TDA8926
Fig.7 Two-chip class-D audio amplifier application diagram for TDA8926J and controller TDA8929T.
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2002 Oct 10
C16 C14
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
TDA8926J/27J & TDA8929T
U1 D1 C24 C34 C35 C41 L7 D2 L6 C27 C40 C25 C26
state of D art Version 21 03-2001
L5 S1 ON MUTE OFF
Out1
Out2
VDD
Silk screen top, top view
GND
VSS
In1
In2
Copper top, top view
17
L4 C6 R16 C17 C15 R15 C9 C32 C12 R13 C5 R11 C33 C10 C8 C7 C43 C13 R10 R14 U2 R12 C11 C4 C3 C39 R1 C2 R5 R19 C1 R20 C38 C36 C22 C23 C37 J5 J6 C44 R24 L2
In1
R21 R22 C28 VDD GND VSS C31 J2 J1
In2
R7 R6
Out1
C21 C20
Out2
C19
R4 C29 J3 J4
Preliminary specification
C18 C30
QGND
MLD634
TDA8926
Silk screen bottom, top view
Copper bottom, top view
Fig.8 Printed-circuit board layout for TDA8926J and controller TDA8929T.
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
15.5 Reference design bill of material
TDA8926
Table 1
Two-chip class-D audio amplifier PCB (Version 2.1; 03-2001) for TDA8926J and TDA8929T (see Figs 7 and 8) DESCRIPTION Cinch input connectors VALUE COMMENTS 2 x Farnell: 152-396 2 x Augat 5KEV-02; 1 x Augat 5KEV-03 PCB switch Knitter ATE 1 E M-O-M TDA8926J/27J TDA8929T 33 H 220 nF/63 V 220 nF/63 V 220 nF/63 V DBS17P package SO24 package 2 x Sumida CDRH127-330 3 x Murata BL01RN1-A62 2 x SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 2 x SMD0805 4 x SMD0805 2 x MKT 2 x SMD1206 4 x SMD0805 2 x SMD1206 4 x MKT 2 x SMD0805 2 x SMD1206 2 x Rubycon ZL very low ESR (large switching currents) 4 x SMD1206 2 x Rubycon ZA low ESR SMD1206 SMD1206 DO-35 DO-35 SMD1206
COMPONENT In1 and In2
Out1, Out2, VDD, supply/output connectors GND and VSS S1 U1 U2 L2 and L4 L5, L6 and L7 C1 and C2 C3 C4 C5 C6 and C7 C8 and C9 C10, C11, C12 and C13 C14 and C16 C15 and C17 C18, C19, C20 and C21 C22 and C23 C24, C25, C26 and C27 C28, C29, C30 and C31 C32 and C33 C34 and C35 C36, C37, C38 and C39 C40 and C41 C43 C44 D1 D2 R1 2002 Oct 10 on/mute/off switch power stage IC controller IC demodulation filter coils power supply ferrite beads supply decoupling capacitors for VDD to VSS of the controller clock decoupling capacitor 12 V decoupling capacitor of the controller
12 V decoupling capacitor of the power 220 nF/63 V stage supply decoupling capacitors for VDD to VSS of the power stage bootstrap capacitors snubber capacitors demodulation filter capacitors resonance suppress capacitors 220 nF/63 V 15 nF/50 V 560 pF/100 V 470 nF/63 V 220 nF/63 V
common mode HF coupling capacitors 1 nF/50 V input filter capacitors input capacitors 330 pF/50 V 470 nF/63 V
common mode HF coupling capacitors 1 nF/50 V power supply decoupling capacitors power supply electrolytic capacitors analog supply decoupling capacitors analog supply electrolytic capacitors diagnostic capacitor mode capacitor 5.6 V Zener diode 7.5 V Zener diode clock adjustment resistor 220 nF/63 V 1500 F/35 V 220 nF/63 V 47 F/35 V 180 pF/50 V 220 nF/63 V BZX79C5V6 BZX79C7V5 27 k 18
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
COMPONENT R4, R5, R6 and R7 R10 R11, R12, R13 and R14 R15 and R16 R19 R20 R21 R22 R24 DESCRIPTION input resistors diagnostic resistor snubber resistors resonance suppression resistors mode select resistor mute select resistor resistor needed when using an asymmetrical supply resistor needed when using an asymmetrical supply VALUE 10 k 1 k 5.6 ; >0.25 W 24 39 k 39 k 10 k 9.1 k
TDA8926
COMMENTS 4 x SMD1206 SMD1206 4 x SMD1206 2 x SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 SMD1206
bias resistor for powering-up the power 200 k stage
2002 Oct 10
19
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
15.6 Curves measured in reference design
MLD627
TDA8926
102 handbook, halfpage THD+N (%) 10
102 handbook, halfpage THD+N (%) 10
MLD628
1
(1)
1
10-1
10-1
(2)
(1)
10-2
(3)
10-2
(2)
10-3 -2 10
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 25 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 8 SE; VP = 25 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.9
Total harmonic distortion plus noise as a function of output power.
Fig.10 Total harmonic distortion plus noise as a function of input frequency.
102 handbook, halfpage THD+N (%) 10
MGU859
102 handbook, halfpage THD+N (%) 10
MLD630
1
(1)
1
(1)
10-1
(2)
10-1
(2)
10-2
(3)
10-2
10-3 10-2
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 4 SE; VP = 21 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 4 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.11 Total harmonic distortion plus noise as a function of output power.
Fig.12 Total harmonic distortion plus as a function of input frequency.
2002 Oct 10
20
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
102 handbook, halfpage THD+N (%) 10
MGU860
102 handbook, halfpage THD+N (%) 10
MLD632
1
(1)
1
10-1
(2)
10-1
(1)
(2)
10-2
(3)
10-2
10-3 10-2
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
1 x 8 BTL; VP = 21 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
1 x 8 BTL; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.13 Total harmonic distortion plus noise as a function of output power.
Fig.14 Total harmonic distortion plus noise as a function of input frequency.
handbook, halfpage
25
MGU855
handbook, halfpage
100
MGU856
P (W) 20
(%)
(3)
(1) (2)
80
15
(1) (2)
60
10
(3)
40
5
20
0 10-2
10-1
1
10
103 102 Po (W)
0 0 20 40 60 80 100 Po (W)
VP = 21 V; fi = 1 kHz. (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
VP = 21 V; fi = 1 kHz. (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
Fig.15 Power dissipation as a function of output power.
Fig.16 Efficiency as a function of output power.
2002 Oct 10
21
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
handbook, halfpage
200 Po 160
MGU857
handbook, halfpage
200 Po
MGU858
(W)
(W) 160
120
120
(1)
80
(1) (2) (3)
80
(2)
(3)
40
40
0 10
15
20
25
30 VP (V)
35
0 10
15
20
25
30 VP (V)
35
THD + N = 0.5%; fi = 1 kHz. (1) 1 x 8 BTL. (2) 2 x 4 SE. (3) 2 x 8 SE.
THD + N = 10%; fi = 1 kHz. (1) 1 x 8 BTL. (2) 2 x 4 SE. (3) 2 x 8 SE.
Fig.17 Output power as a function of supply voltage.
Fig.18 Output power as a function of supply voltage.
handbook, halfpage
0 cs -20
MLD613
handbook, halfpage
0 cs -20
MLD614
(dB)
(dB)
-40
-40
-60
(1)
-60
(1)
-80
(2)
-80
(2)
-100
10
102
103
104
f i (Hz)
105
-100
10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
2 x 4 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.19 Channel separation as a function of input frequency.
Fig.20 Channel separation as a function of input frequency.
2002 Oct 10
22
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
handbook, halfpage
45
MLD615
handbook, halfpage
45
MLD616
G (dB) 40
G (dB) 40
(1)
35
(1)
35
(2)
30
(2)
30
(3)
25
(3)
25
20
10
102
103
104
f i (Hz)
105
20
10
102
103
104
f i (Hz)
105
VP = 21 V; Vi = 100 mV; Rs = 10 k/Ci = 330 pF. (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
VP = 21 V; Vi = 100 mV; Rs = 0 . (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
Fig.21 Gain as a function of input frequency.
Fig.22 Gain as a function of input frequency.
handbook, halfpage
0
MLD617
handbook, halfpage
0
MLD618
SVRR (dB) -20
SVRR (dB) -20
-40
(1)
-40
(1)
-60
(2) (3)
-60
(2) (3)
-80
-80
-100
10
102
103
104
f i (Hz)
105
-100
0
1
2
3
4 5 Vripple(p-p) (V)
VP = 21 V; Vripple(p-p) = 2 V. (1) Both supply lines in antiphase. (2) Both supply lines in phase. (3) One supply line rippled.
VP = 21 V. (1) fripple = 1 kHz. (2) fripple = 100 Hz. (3) fripple = 10 Hz.
Fig.23 Supply voltage ripple rejection as a function of input frequency.
Fig.24 Supply voltage ripple rejection as a function of ripple voltage (peak-to-peak value).
2002 Oct 10
23
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
handbook, halfpage
100 Iq
MLD619
handbook, halfpage
380
MLD620
(mA) 80
fclk (kHz)
372
60
364
40
356
20
348
0 0 10 20 30 37.5 VP (V)
340 0 10 20 30 VP (V) RL = open-circuit. 40
RL = open-circuit.
Fig.25 Quiescent current as a function of supply voltage.
Fig.26 Clock frequency as a function of supply voltage.
handbook, halfpage
5 Vripple (V) 4
MLD621
MLD622
handbook, halfpage
5
SVRR (%) 4
3
(1)
3
(1)
2
2
1
(2)
1
(2)
0 10-2
10-1
1
10
Po (W)
102
0 10
102
103
f i (Hz)
104
VP = 21 V; 1500 F per supply line; fi = 10 Hz. (1) 1 x 4 SE. (2) 1 x 8 SE.
VP = 21 V; 1500 F per supply line. (1) Po = 30 W into 1 x 4 SE. (2) Po = 15 W into 1 x 8 SE.
Fig.27 Supply voltage ripple as a function of output power.
Fig.28 Supply voltage ripple rejection as a function of input frequency.
2002 Oct 10
24
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926
handbook, halfpage
10
MLD623
handbook, halfpage
THD+N (%) 1
(1)
50 Po 40
MLD624
(W)
30 10-1
(2) (3)
20
10-2
10
10-3 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 21 V; Po = 1 W in 2 x 8 . (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
VP = 21 V; RL = 2 x 8 ; fi = 1 kHz; THD + N = 10%.
Fig.29 Total harmonic distortion plus noise as a function of clock frequency.
Fig.30 Output power as a function of clock frequency.
handbook, halfpage
150 Iq 120
MLD625
handbook, halfpage
1000
MLD626
Vr(PWM) (mV) 800
(mA)
90
600
60
400
30
200
0 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 25 V; RL = open-circuit.
VP = 25 V; RL = 2 x 8 .
Fig.31 Quiescent current as a function of clock frequency.
Fig.32 PWM residual voltage as a function of clock frequency.
2002 Oct 10
25
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
16 PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
TDA8926
SOT243-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
17 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-12-16 99-12-17
2002 Oct 10
26
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
17 SOLDERING 17.1 Introduction to soldering through-hole mount packages
TDA8926
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. 17.4
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE suitable(1)
DBS, DIP, HDIP, SDIP, SIL Note
suitable
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Oct 10
27
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
18 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDA8926
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Oct 10
28
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
NOTES
TDA8926
2002 Oct 10
29
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
NOTES
TDA8926
2002 Oct 10
30
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
NOTES
TDA8926
2002 Oct 10
31
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp32
Date of release: 2002
Oct 10
Document order number:
9397 750 09591

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